HSE-B18508-035H CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218, 50
Packaging: Box
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 12.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.86°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
auf Bestellung 1333 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.15 EUR |
| 10+ | 2.99 EUR |
| 25+ | 2.92 EUR |
| 50+ | 2.84 EUR |
| 100+ | 2.68 EUR |
| 250+ | 2.52 EUR |
| 500+ | 2.36 EUR |
| 1000+ | 2.21 EUR |
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Technische Details HSE-B18508-035H CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218, 50, Packaging: Box, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 12.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 200 LFM, Thermal Resistance @ Natural: 5.86°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B18508-035H nach Preis ab 3.46 EUR bis 4.11 EUR
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HSE-B18508-035H | Hersteller : CUI Devices |
Heat Sinks 50.8x41.6x25mm w/pin extrusion TO-218 |
auf Bestellung 763 Stücke: Lieferzeit 14-28 Tag (e) |
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