HSE-B18508-060H-W CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION,TO-218, 50.
Packaging: Box
Material: Aluminum Alloy
Length: 2.000" (50.80mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.638" (41.60mm)
Package Cooled: TO-218
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 12.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.86°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
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Technische Details HSE-B18508-060H-W CUI Devices
Description: HEAT SINK, EXTRUSION,TO-218, 50., Packaging: Box, Material: Aluminum Alloy, Length: 2.000" (50.80mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.638" (41.60mm), Package Cooled: TO-218, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 12.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 200 LFM, Thermal Resistance @ Natural: 5.86°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B18508-060H-W
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSE-B18508-060H-W | Hersteller : CUI Devices |
Heat Sinks 50.8x41.6x25mm w/pin extrusion TO-218 |
Produkt ist nicht verfügbar |