HSE-B20500-040H-01 CUI Devices
Hersteller: CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 50
Material Finish: Black Anodized
Fin Height: 0.492" (12.50mm)
Thermal Resistance @ Natural: 8.43°C/W
Thermal Resistance @ Forced Air Flow: 8.90°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 8.9W @ 75°C
Attachment Method: PC Pin
Package Cooled: TO-220
Width: 1.359" (34.50mm)
Type: Board Level, Vertical
Shape: Rectangular, Angled Fins
Length: 1.969" (50.00mm)
Material: Aluminum Alloy
Packaging: Box
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Technische Details HSE-B20500-040H-01 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 50, Material Finish: Black Anodized, Fin Height: 0.492" (12.50mm), Thermal Resistance @ Natural: 8.43°C/W, Thermal Resistance @ Forced Air Flow: 8.90°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 8.9W @ 75°C, Attachment Method: PC Pin, Package Cooled: TO-220, Width: 1.359" (34.50mm), Type: Board Level, Vertical, Shape: Rectangular, Angled Fins, Length: 1.969" (50.00mm), Material: Aluminum Alloy, Packaging: Box.
Weitere Produktangebote HSE-B20500-040H-01
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
|---|---|---|---|---|---|
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HSE-B20500-040H-01 | CUI Devices |
Heat Sinks 50x29x12.5mm w/pin extrusion TO-220 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1800 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HSE-B20500-040H-01 |
|
Hersteller: CUI Devices
Heat Sinks 50x29x12.5mm w/pin extrusion TO-220
Heat Sinks 50x29x12.5mm w/pin extrusion TO-220
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
Im Einkaufswagen
Stück im Wert von UAH