HSE-B254-045H CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-220, 25
Packaging: Box
Material: Aluminum Alloy
Length: 1.000" (25.40mm)
Shape: Rectangular, Angled Fins
Type: Board Level, Vertical
Width: 1.772" (45.00mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 6.4W @ 75°C
Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM
Thermal Resistance @ Natural: 11.72°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 630 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 10+ | 1.77 EUR |
| 25+ | 1.72 EUR |
| 50+ | 1.68 EUR |
| 100+ | 1.58 EUR |
| 250+ | 1.49 EUR |
| 500+ | 1.4 EUR |
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Technische Details HSE-B254-045H CUI Devices
Description: HEAT SINK, EXTRUSION, TO-220, 25, Packaging: Box, Material: Aluminum Alloy, Length: 1.000" (25.40mm), Shape: Rectangular, Angled Fins, Type: Board Level, Vertical, Width: 1.772" (45.00mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 6.4W @ 75°C, Thermal Resistance @ Forced Air Flow: 3.86°C/W @ 200 LFM, Thermal Resistance @ Natural: 11.72°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
Weitere Produktangebote HSE-B254-045H nach Preis ab 1.8 EUR bis 2.3 EUR
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