HSE04-251265-2 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 0.984" (25.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 0.472" (12.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 2.47W @ 75°C
Thermal Resistance @ Forced Air Flow: 16.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 30.38°C/W
Fin Height: 0.256" (6.50mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1578 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 2.02 EUR |
| 25+ | 1.96 EUR |
| 50+ | 1.84 EUR |
| 100+ | 1.65 EUR |
| 250+ | 1.63 EUR |
| 500+ | 1.52 EUR |
| 1000+ | 1.5 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSE04-251265-2 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 0.984" (25.00mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 0.472" (12.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 2.47W @ 75°C, Thermal Resistance @ Forced Air Flow: 16.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 30.38°C/W, Fin Height: 0.256" (6.50mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE04-251265-2 nach Preis ab 1.54 EUR bis 2.1 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
HSE04-251265-2 | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 25 x 12 x 6.5 mm |
auf Bestellung 1647 Stücke: Lieferzeit 14-28 Tag (e) |
|