HSE07-753045 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 2.953" (75.00mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.181" (30.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 15.46W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM
Thermal Resistance @ Natural: 4.85°C/W
Fin Height: 1.772" (45.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 970 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 8.16 EUR |
| 10+ | 7.89 EUR |
| 25+ | 7.66 EUR |
| 50+ | 7.2 EUR |
| 100+ | 6.47 EUR |
| 250+ | 6.38 EUR |
| 500+ | 5.97 EUR |
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Technische Details HSE07-753045 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 2.953" (75.00mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.181" (30.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Clip, Power Dissipation @ Temperature Rise: 15.46W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.10°C/W @ 200 LFM, Thermal Resistance @ Natural: 4.85°C/W, Fin Height: 1.772" (45.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE07-753045 nach Preis ab 6.01 EUR bis 8.22 EUR
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HSE07-753045 | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 75 x 30 x 45 mm |
auf Bestellung 841 Stücke: Lieferzeit 14-28 Tag (e) |
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