HSE09-755028 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, EXTRUSION, TO-218/TO-
Packaging: Bag
Material: Aluminum Alloy
Length: 2.953" (75.00mm)
Shape: Rectangular, Angled Fins
Type: Board Level
Width: 1.102" (28.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Clip
Power Dissipation @ Temperature Rise: 13.26W @ 75°C
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 5.66°C/W
Fin Height: 1.969" (50.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 967 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 4+ | 5.61 EUR |
| 10+ | 5.42 EUR |
| 25+ | 5.27 EUR |
| 50+ | 4.95 EUR |
| 100+ | 4.45 EUR |
| 250+ | 4.39 EUR |
| 500+ | 4.11 EUR |
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Technische Details HSE09-755028 CUI Devices
Description: HEAT SINK, EXTRUSION, TO-218/TO-, Packaging: Bag, Material: Aluminum Alloy, Length: 2.953" (75.00mm), Shape: Rectangular, Angled Fins, Type: Board Level, Width: 1.102" (28.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Clip, Power Dissipation @ Temperature Rise: 13.26W @ 75°C, Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 5.66°C/W, Fin Height: 1.969" (50.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSE09-755028 nach Preis ab 6.08 EUR bis 8.35 EUR
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HSE09-755028 | Hersteller : CUI Devices |
Heat Sinks heat sink, extrusion, TO-218/TO-220, 75 x 50 x 28 mm |
auf Bestellung 2747 Stücke: Lieferzeit 14-28 Tag (e) |
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