HSEC8-108-01-L-DP-A-K Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 16POS 0.031
Number of Rows: 2
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 16
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place
Packaging: Cut Tape (CT)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.15 EUR |
| 10+ | 12.35 EUR |
| 25+ | 11.14 EUR |
| 50+ | 10.34 EUR |
| 100+ | 9.6 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HSEC8-108-01-L-DP-A-K Samtec Inc.
Description: CONN PCI EXP FMALE 16POS 0.031, Number of Rows: 2, Contact Material: Beryllium Copper, Contact Finish Thickness: 10.0µin (0.25µm), Termination: Solder, Card Thickness: 0.063" (1.60mm), Card Type: PCI Express™, Contact Type: Cantilever, Read Out: Dual, Operating Temperature: -55°C ~ 125°C, Pitch: 0.031" (0.80mm), Number of Positions: 16, Mounting Type: Surface Mount, Color: Black, Contact Finish: Gold, Gender: Female, Features: Board Guide, Pick and Place, Packaging: Tape & Reel (TR).
Weitere Produktangebote HSEC8-108-01-L-DP-A-K
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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HSEC8-108-01-L-DP-A-K | Samtec Inc. |
Description: CONN PCI EXP FMALE 16POS 0.031 Number of Rows: 2 Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Termination: Solder Card Thickness: 0.063" (1.60mm) Card Type: PCI Express™ Contact Type: Cantilever Read Out: Dual Operating Temperature: -55°C ~ 125°C Pitch: 0.031" (0.80mm) Number of Positions: 16 Mounting Type: Surface Mount Color: Black Contact Finish: Gold Gender: Female Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH |
 |
HSEC8-108-01-L-DP-A-K | Samtec |
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 250 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HSEC8-108-01-L-DP-A-K |
|
Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 16POS 0.031
Number of Rows: 2
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 16
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Description: CONN PCI EXP FMALE 16POS 0.031
Number of Rows: 2
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 16
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| HSEC8-108-01-L-DP-A-K |
|
Hersteller: Samtec
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen
Stück im Wert von UAH