Produkte > SAMTEC INC. > HSEC8-108-01-L-DP-A-K
HSEC8-108-01-L-DP-A-K

HSEC8-108-01-L-DP-A-K Samtec Inc.


hsec8-dp.pdf Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 16POS 0.031
Packaging: Cut Tape (CT)
Features: Board Guide, Pick and Place
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.063" (1.60mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Rows: 2
auf Bestellung 152 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.57 EUR
10+10.38 EUR
25+9.36 EUR
50+8.69 EUR
100+8.07 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
Produktrezensionen
Produktbewertung abgeben

Technische Details HSEC8-108-01-L-DP-A-K Samtec Inc.

Description: CONN PCI EXP FMALE 16POS 0.031, Packaging: Tape & Reel (TR), Features: Board Guide, Pick and Place, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 16, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: PCI Express™, Card Thickness: 0.063" (1.60mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Beryllium Copper, Number of Rows: 2.

Weitere Produktangebote HSEC8-108-01-L-DP-A-K

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis
HSEC8-108-01-L-DP-A-K Hersteller : Samtec hsec8_dv.pdf HSEC8-108-01-L-DP-A-K
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
HSEC8-108-01-L-DP-A-K HSEC8-108-01-L-DP-A-K Hersteller : Samtec Inc. hsec8-dp.pdf Description: CONN PCI EXP FMALE 16POS 0.031
Packaging: Tape & Reel (TR)
Features: Board Guide, Pick and Place
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: PCI Express™
Card Thickness: 0.063" (1.60mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Rows: 2
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
HSEC8-108-01-L-DP-A-K HSEC8-108-01-L-DP-A-K Hersteller : Samtec hsec8-dp.pdf Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH