Produkte > SAMTEC INC. > HSEC8-120-01-L-DP-A-WT-K

HSEC8-120-01-L-DP-A-WT-K Samtec Inc.


hsec8-dp.pdf
Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 40POS 0.031
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 40
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Tape & Reel (TR)
Number of Rows: 2
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
250+9.44 EUR
Mindestbestellmenge: 250 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
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Technische Details HSEC8-120-01-L-DP-A-WT-K Samtec Inc.

Description: CONN PCI EXP FMALE 40POS 0.031, Contact Material: Beryllium Copper, Contact Finish Thickness: 10.0µin (0.25µm), Termination: Solder, Card Thickness: 0.063" (1.60mm), Card Type: PCI Express™, Contact Type: Cantilever, Read Out: Dual, Operating Temperature: -55°C ~ 125°C, Pitch: 0.031" (0.80mm), Number of Positions: 40, Mounting Type: Surface Mount, Color: Black, Contact Finish: Gold, Gender: Female, Features: Board Guide, Pick and Place, Solder Retention, Packaging: Tape & Reel (TR), Number of Rows: 2.

Weitere Produktangebote HSEC8-120-01-L-DP-A-WT-K nach Preis ab 10.58 EUR bis 13.16 EUR

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Preis
HSEC8-120-01-L-DP-A-WT-K Samtec Inc. hsec8-dp.pdf Description: CONN PCI EXP FMALE 40POS 0.031
Number of Rows: 2
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 40
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.16 EUR
10+11.84 EUR
25+11.15 EUR
50+10.87 EUR
100+10.58 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
HSEC8-120-01-L-DP-A-WT-K hsec8-dp.pdf
Hersteller: Samtec Inc.
Description: CONN PCI EXP FMALE 40POS 0.031
Number of Rows: 2
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.063" (1.60mm)
Card Type: PCI Express™
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 40
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Features: Board Guide, Pick and Place, Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+13.16 EUR
10+11.84 EUR
25+11.15 EUR
50+10.87 EUR
100+10.58 EUR
Mindestbestellmenge: 2 Stücke
Im Einkaufswagen  Stück im Wert von  UAH