Technische Details HSEC8-130-01-L-DV-K Samtec
Description: CONN EDGE DUAL FMALE 60POS 0.031, Number of Rows: 2, Part Status: Active, Number of Positions/Bay/Row: 30, Contact Material: Beryllium Copper, Contact Finish Thickness: 10.0µin (0.25µm), Termination: Solder, Card Thickness: 0.062" (1.57mm), Card Type: Non Specified - Dual Edge, Contact Type: Cantilever, Read Out: Dual, Operating Temperature: -55°C ~ 125°C, Pitch: 0.031" (0.80mm), Number of Positions: 60, Mounting Type: Surface Mount, Color: Black, Contact Finish: Gold, Gender: Female, Packaging: Tray.
Weitere Produktangebote HSEC8-130-01-L-DV-K nach Preis ab 6.91 EUR bis 13.5 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
HSEC8-130-01-L-DV-K | Samtec Inc. |
Description: CONN EDGE DUAL FMALE 60POS 0.031Number of Rows: 2 Part Status: Active Number of Positions/Bay/Row: 30 Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Termination: Solder Card Thickness: 0.062" (1.57mm) Card Type: Non Specified - Dual Edge Contact Type: Cantilever Read Out: Dual Operating Temperature: -55°C ~ 125°C Pitch: 0.031" (0.80mm) Number of Positions: 60 Mounting Type: Surface Mount Color: Black Contact Finish: Gold Gender: Female Packaging: Tray |
auf Bestellung 468 Stücke: Lieferzeit 10-14 Tag (e) |
|
| HSEC8-130-01-L-DV-K |
![]() |
Hersteller: Samtec Inc.
Description: CONN EDGE DUAL FMALE 60POS 0.031
Number of Rows: 2
Part Status: Active
Number of Positions/Bay/Row: 30
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: Non Specified - Dual Edge
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 60
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Packaging: Tray
Description: CONN EDGE DUAL FMALE 60POS 0.031
Number of Rows: 2
Part Status: Active
Number of Positions/Bay/Row: 30
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Termination: Solder
Card Thickness: 0.062" (1.57mm)
Card Type: Non Specified - Dual Edge
Contact Type: Cantilever
Read Out: Dual
Operating Temperature: -55°C ~ 125°C
Pitch: 0.031" (0.80mm)
Number of Positions: 60
Mounting Type: Surface Mount
Color: Black
Contact Finish: Gold
Gender: Female
Packaging: Tray
auf Bestellung 468 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 13.5 EUR |
| 10+ | 10.35 EUR |
| 25+ | 9.34 EUR |
| 40+ | 8.87 EUR |
| 80+ | 8.23 EUR |
| 230+ | 7.37 EUR |
| 440+ | 6.91 EUR |



