HSEC8-130-01-L-DV Samtec
Hersteller: Samtec
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
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Technische Details HSEC8-130-01-L-DV Samtec
Description: CONN EDGE DUAL FMALE 60POS 0.031, Packaging: Tray, Gender: Female, Contact Finish: Gold, Color: Black, Mounting Type: Surface Mount, Number of Positions: 60, Pitch: 0.031" (0.80mm), Operating Temperature: -55°C ~ 125°C, Read Out: Dual, Contact Type: Cantilever, Card Type: Non Specified - Dual Edge, Card Thickness: 0.062" (1.57mm), Termination: Solder, Contact Finish Thickness: 10.0µin (0.25µm), Contact Material: Beryllium Copper, Number of Positions/Bay/Row: 30, Number of Rows: 2.
Weitere Produktangebote HSEC8-130-01-L-DV nach Preis ab 10.04 EUR bis 16.42 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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HSEC8-130-01-L-DV | Samtec Inc. |
Description: CONN EDGE DUAL FMALE 60POS 0.031 Packaging: Tray Gender: Female Contact Finish: Gold Color: Black Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.031" (0.80mm) Operating Temperature: -55°C ~ 125°C Read Out: Dual Contact Type: Cantilever Card Type: Non Specified - Dual Edge Card Thickness: 0.062" (1.57mm) Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Beryllium Copper Number of Positions/Bay/Row: 30 Number of Rows: 2 |
auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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| HSEC8-130-01-L-DV |
|
Hersteller: Samtec Inc.
Description: CONN EDGE DUAL FMALE 60POS 0.031
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: Non Specified - Dual Edge
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
Description: CONN EDGE DUAL FMALE 60POS 0.031
Packaging: Tray
Gender: Female
Contact Finish: Gold
Color: Black
Mounting Type: Surface Mount
Number of Positions: 60
Pitch: 0.031" (0.80mm)
Operating Temperature: -55°C ~ 125°C
Read Out: Dual
Contact Type: Cantilever
Card Type: Non Specified - Dual Edge
Card Thickness: 0.062" (1.57mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Beryllium Copper
Number of Positions/Bay/Row: 30
Number of Rows: 2
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 2+ | 16.42 EUR |
| 10+ | 12.61 EUR |
| 25+ | 11.39 EUR |
| 40+ | 10.82 EUR |
| 80+ | 10.04 EUR |