HSS-B20-074H CUI Devices
Hersteller: CUI Devices
Description: HEATSINK TO-220 3.6W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.394" (10.00mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.830" (21.08mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.6W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.39°C/W @ 200 LFM
Thermal Resistance @ Natural: 20.59°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
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Technische Details HSS-B20-074H CUI Devices
Description: HEATSINK TO-220 3.6W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.394" (10.00mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.830" (21.08mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 3.6W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.39°C/W @ 200 LFM, Thermal Resistance @ Natural: 20.59°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized.
Weitere Produktangebote HSS-B20-074H
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
 |
HSS-B20-074H | CUI Devices |
Heat Sinks 19 x 21.2 x 10mm TO-220 solder pin |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HSS-B20-074H |
|
Hersteller: CUI Devices
Heat Sinks 19 x 21.2 x 10mm TO-220 solder pin
Heat Sinks 19 x 21.2 x 10mm TO-220 solder pin
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH