HSS-B20-0953H-02 CUI Devices
Hersteller: CUI DevicesDescription: HEATSINK TO-220 2.9W ALUMINUM
Packaging: Bag
Material: Aluminum
Length: 0.500" (12.70mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.504" (12.80mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.9W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.92°C/W
Fin Height: 0.748" (19.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2935 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 24+ | 0.74 EUR |
| 25+ | 0.71 EUR |
| 26+ | 0.68 EUR |
| 50+ | 0.66 EUR |
| 100+ | 0.65 EUR |
| 250+ | 0.61 EUR |
| 500+ | 0.57 EUR |
| 1000+ | 0.52 EUR |
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Technische Details HSS-B20-0953H-02 CUI Devices
Description: HEATSINK TO-220 2.9W ALUMINUM, Packaging: Bag, Material: Aluminum, Length: 0.500" (12.70mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.504" (12.80mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.9W @ 75°C, Thermal Resistance @ Forced Air Flow: 7.24°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.92°C/W, Fin Height: 0.748" (19.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS-B20-0953H-02 nach Preis ab 0.57 EUR bis 0.75 EUR
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HSS-B20-0953H-02 | Hersteller : CUI Devices |
Heat Sinks 19 x 12.8 x 12.7mm TO-220 solder pin |
auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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