HSS-C2540-SMT-TR CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK TO-263 COPPER
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Board Level
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Power Dissipation @ Temperature Rise: 3.8W @ 75°C
Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM
Thermal Resistance @ Natural: 21.90°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 6+ | 3.15 EUR |
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Technische Details HSS-C2540-SMT-TR CUI Devices
Description: HEAT SINK TO-263 COPPER, Packaging: Tape & Reel (TR), Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Board Level, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Power Dissipation @ Temperature Rise: 3.8W @ 75°C, Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM, Thermal Resistance @ Natural: 21.90°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS-C2540-SMT-TR nach Preis ab 3.04 EUR bis 4.06 EUR
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HSS-C2540-SMT-TR | Hersteller : CUI Devices |
Heat Sinks 19.38 x 25.4x11.43mm TO-263 SMT |
auf Bestellung 5217 Stücke: Lieferzeit 14-28 Tag (e) |
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HSS-C2540-SMT-TR | Hersteller : CUI Devices |
Description: HEAT SINK TO-263 COPPER Packaging: Tape & Reel (TR) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Board Level Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Power Dissipation @ Temperature Rise: 3.8W @ 75°C Thermal Resistance @ Forced Air Flow: 5.50°C/W @ 200 LFM Thermal Resistance @ Natural: 21.90°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
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