HSS06-C20-P32 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 27.
Packaging: Box
Material: Copper Alloy
Length: 1.101" (27.96mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.866" (22.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 10.60°C/W @ 200 LFM
Thermal Resistance @ Natural: 25.35°C/W
Fin Height: 0.375" (9.52mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 358 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 11+ | 1.62 EUR |
| 25+ | 1.58 EUR |
| 50+ | 1.54 EUR |
| 100+ | 1.5 EUR |
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Technische Details HSS06-C20-P32 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 27., Packaging: Box, Material: Copper Alloy, Length: 1.101" (27.96mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.866" (22.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 3.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 10.60°C/W @ 200 LFM, Thermal Resistance @ Natural: 25.35°C/W, Fin Height: 0.375" (9.52mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote HSS06-C20-P32 nach Preis ab 1.73 EUR bis 2.31 EUR
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HSS06-C20-P32 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 27.96 x 22 |
auf Bestellung 6396 Stücke: Lieferzeit 10-14 Tag (e) |
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