HSS09-B20-P431 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 29.
Packaging: Box
Material: Aluminum Alloy
Length: 1.180" (29.97mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 1.000" (25.40mm)
Package Cooled: TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 4.0W @ 75°C
Thermal Resistance @ Forced Air Flow: 7.70°C/W @ 200 LFM
Thermal Resistance @ Natural: 18.82°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2605 Stücke:
Lieferzeit 21-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 13+ | 2.04 EUR |
| 25+ | 1.94 EUR |
| 50+ | 1.88 EUR |
| 100+ | 1.86 EUR |
| 250+ | 1.73 EUR |
| 500+ | 1.63 EUR |
| 1000+ | 1.48 EUR |
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Technische Details HSS09-B20-P431 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 29., Packaging: Box, Material: Aluminum Alloy, Length: 1.180" (29.97mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 1.000" (25.40mm), Package Cooled: TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 4.0W @ 75°C, Thermal Resistance @ Forced Air Flow: 7.70°C/W @ 200 LFM, Thermal Resistance @ Natural: 18.82°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS09-B20-P431 nach Preis ab 1.59 EUR bis 2.08 EUR
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HSS09-B20-P431 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 29.97 x 25. |
auf Bestellung 2451 Stücke: Lieferzeit 14-28 Tag (e) |
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