HSS12-B20-P95 CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-220, 19
Packaging: Box
Material: Aluminum Alloy
Length: 0.866" (22.00mm)
Shape: Rectangular
Type: Board Level, Vertical
Width: 0.748" (19.00mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 2.7W @ 75°C
Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 200 LFM
Thermal Resistance @ Natural: 27.37°C/W
Fin Height: 0.433" (11.00mm)
Material Finish: Black Anodized
Part Status: Active
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Technische Details HSS12-B20-P95 CUI Devices
Description: HEAT SINK, STAMPING, TO-220, 19, Packaging: Box, Material: Aluminum Alloy, Length: 0.866" (22.00mm), Shape: Rectangular, Type: Board Level, Vertical, Width: 0.748" (19.00mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 2.7W @ 75°C, Thermal Resistance @ Forced Air Flow: 10.90°C/W @ 200 LFM, Thermal Resistance @ Natural: 27.37°C/W, Fin Height: 0.433" (11.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS12-B20-P95
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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HSS12-B20-P95 | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-220, 19 x 22 x 1 |
Produkt ist nicht verfügbar |