HSS24-B20-NP CUI Devices
Hersteller: CUI DevicesDescription: HEAT SINK, STAMPING, TO-218/TO-2
Packaging: Box
Material: Aluminum Alloy
Length: 1.654" (42.00mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.496" (38.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On
Power Dissipation @ Temperature Rise: 7.85W @ 75°C
Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
Thermal Resistance @ Natural: 9.56°C/W
Fin Height: 0.984" (25.00mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 2853 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 12+ | 1.89 EUR |
| 25+ | 1.79 EUR |
| 50+ | 1.75 EUR |
| 100+ | 1.72 EUR |
| 250+ | 1.6 EUR |
| 500+ | 1.51 EUR |
| 1000+ | 1.37 EUR |
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Technische Details HSS24-B20-NP CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Box, Material: Aluminum Alloy, Length: 1.654" (42.00mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.496" (38.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On, Power Dissipation @ Temperature Rise: 7.85W @ 75°C, Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM, Thermal Resistance @ Natural: 9.56°C/W, Fin Height: 0.984" (25.00mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote HSS24-B20-NP nach Preis ab 1.78 EUR bis 2.32 EUR
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HSS24-B20-NP | Hersteller : CUI Devices |
Heat Sinks heat sink, stamping, TO-218/TO-220, 38 x 42 x 25 mm, no pin |
auf Bestellung 1894 Stücke: Lieferzeit 14-28 Tag (e) |
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