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HSS28-B20-P39

HSS28-B20-P39 CUI Devices

hss28-b20-p39.pdf Hersteller: CUI Devices
Description: HEAT SINK, STAMPING, TO-218/TO-2
Packaging: Bag
Material: Aluminum Alloy
Length: 0.748" (19.00mm)
Shape: Square, Fins
Type: Board Level
Width: 0.748" (19.00mm)
Package Cooled: TO-218, TO-220
Attachment Method: Bolt On and PC Pin
Power Dissipation @ Temperature Rise: 2.71W @ 75°C
Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM
Thermal Resistance @ Natural: 27.66°C/W
Fin Height: 0.374" (9.50mm)
Material Finish: Black Anodized
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Technische Details HSS28-B20-P39 CUI Devices

Description: HEAT SINK, STAMPING, TO-218/TO-2, Packaging: Bag, Material: Aluminum Alloy, Length: 0.748" (19.00mm), Shape: Square, Fins, Type: Board Level, Width: 0.748" (19.00mm), Package Cooled: TO-218, TO-220, Attachment Method: Bolt On and PC Pin, Power Dissipation @ Temperature Rise: 2.71W @ 75°C, Thermal Resistance @ Forced Air Flow: 12.00°C/W @ 200 LFM, Thermal Resistance @ Natural: 27.66°C/W, Fin Height: 0.374" (9.50mm), Material Finish: Black Anodized.