HTSS-110-01-T-DV Samtec
| Anzahl | Privatkunde |
|---|---|
| 2+ | 3.14 EUR |
| 57+ | 2.64 EUR |
| 114+ | 2.39 EUR |
| 5016+ | 2.12 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HTSS-110-01-T-DV Samtec
Description: CONN HEADER SMD 20POS 2.54MM, Packaging: Tube, Features: Keying Slot, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 20, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Weitere Produktangebote HTSS-110-01-T-DV nach Preis ab 2.3 EUR bis 3.75 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||
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HTSS-110-01-T-DV | Samtec Inc. |
Description: CONN HEADER SMD 20POS 2.54MMPackaging: Tube Features: Keying Slot Connector Type: Header Mounting Type: Surface Mount Number of Positions: 20 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.250" (6.35mm) |
auf Bestellung 2133 Stücke: Lieferzeit 10-14 Tag (e) |
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HTSS-110-01-T-DV | SAMTEC |
Description: SAMTEC - HTSS-110-01-T-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, HTSStariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 20Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: HTSS productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 2.54mm SVHC: No SVHC (25-Jun-2025) |
auf Bestellung 20 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| HTSS-110-01-T-DV |
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Hersteller: Samtec Inc.
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Features: Keying Slot
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
Description: CONN HEADER SMD 20POS 2.54MM
Packaging: Tube
Features: Keying Slot
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 20
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Part Status: Active
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
auf Bestellung 2133 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.75 EUR |
| 10+ | 3.18 EUR |
| 100+ | 2.7 EUR |
| 500+ | 2.42 EUR |
| 1000+ | 2.3 EUR |
| HTSS-110-01-T-DV |
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Hersteller: SAMTEC
Description: SAMTEC - HTSS-110-01-T-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, HTSS
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: HTSS
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (25-Jun-2025)
Description: SAMTEC - HTSS-110-01-T-DV - Stiftleiste, Board-to-Board, 2.54 mm, 2 Reihe(n), 20 Kontakt(e), Oberflächenmontage, HTSS
tariffCode: 85366930
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Phosphorbronze
usEccn: EAR99
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 20Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: HTSS
productTraceability: No
Kontaktanschluss: Oberflächenmontage
Anzahl der Reihen: 2Reihe(n)
Rastermaß: 2.54mm
SVHC: No SVHC (25-Jun-2025)
auf Bestellung 20 Stücke:
Lieferzeit 14-21 Tag (e)




