HTSS-115-01-T-DV Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 5.12 EUR |
| 52+ | 4.17 EUR |
| 104+ | 3.54 EUR |
| 507+ | 3.15 EUR |
| 1001+ | 3.04 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HTSS-115-01-T-DV Samtec
Description: CONN HEADER SMD 30POS 2.54MM, Features: Keying Slot, Packaging: Tube, Connector Type: Header, Mounting Type: Surface Mount, Number of Positions: 30, Number of Rows: 2, Style: Board to Board or Cable, Operating Temperature: -55°C ~ 105°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Natural, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.350" (8.89mm), Shrouding: Shrouded - 4 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.250" (6.35mm).
Weitere Produktangebote HTSS-115-01-T-DV
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| HTSS-115-01-T-DV | Samtec Inc. |
Description: CONN HEADER SMD 30POS 2.54MM Features: Keying Slot Packaging: Tube Connector Type: Header Mounting Type: Surface Mount Number of Positions: 30 Number of Rows: 2 Style: Board to Board or Cable Operating Temperature: -55°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Natural Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.350" (8.89mm) Shrouding: Shrouded - 4 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.250" (6.35mm) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 13 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HTSS-115-01-T-DV |
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 30POS 2.54MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
Description: CONN HEADER SMD 30POS 2.54MM
Features: Keying Slot
Packaging: Tube
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 30
Number of Rows: 2
Style: Board to Board or Cable
Operating Temperature: -55°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Phosphor Bronze
Insulation Color: Natural
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish - Post: Tin
Contact Shape: Square
Insulation Height: 0.350" (8.89mm)
Shrouding: Shrouded - 4 Wall
Insulation Material: Liquid Crystal Polymer (LCP)
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.250" (6.35mm)
Produkt ist nicht verfügbar
Mindestbestellmenge: 13 Stücke
Im Einkaufswagen
Stück im Wert von UAH


