HTST-113-01-SM-DV Samtec
| Anzahl | Preis |
|---|---|
| 1+ | 8.92 EUR |
| 28+ | 8.06 EUR |
| 56+ | 7.5 EUR |
| 112+ | 7.13 EUR |
| 504+ | 6.92 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details HTST-113-01-SM-DV Samtec
Description: CONN HEADER SMD 26POS 2.54MM, Contact Length - Mating: 0.250" (6.35mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Liquid Crystal Polymer (LCP), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.350" (8.89mm), Contact Shape: Square, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Insulation Color: Natural, Contact Material: Phosphor Bronze, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Push-Pull, Contact Type: Male Pin, Operating Temperature: -55°C ~ 125°C, Style: Board to Cable/Wire, Number of Rows: 2, Number of Positions: 26, Mounting Type: Surface Mount, Current Rating (Amps): 3.4A per Contact, Connector Type: Header, Features: Keying Slot, Packaging: Tube.
Weitere Produktangebote HTST-113-01-SM-DV
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
|
HTST-113-01-SM-DV | Samtec Inc. |
Description: CONN HEADER SMD 26POS 2.54MMContact Length - Mating: 0.250" (6.35mm) Row Spacing - Mating: 0.100" (2.54mm) Insulation Material: Liquid Crystal Polymer (LCP) Shrouding: Shrouded - 4 Wall Insulation Height: 0.350" (8.89mm) Contact Shape: Square Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Natural Contact Material: Phosphor Bronze Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Operating Temperature: -55°C ~ 125°C Style: Board to Cable/Wire Number of Rows: 2 Number of Positions: 26 Mounting Type: Surface Mount Current Rating (Amps): 3.4A per Contact Connector Type: Header Features: Keying Slot Packaging: Tube |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 14 Stücke Im Einkaufswagen Stück im Wert von UAH |
| HTST-113-01-SM-DV |
![]() |
Hersteller: Samtec Inc.
Description: CONN HEADER SMD 26POS 2.54MM
Contact Length - Mating: 0.250" (6.35mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.350" (8.89mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 26
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header
Features: Keying Slot
Packaging: Tube
Description: CONN HEADER SMD 26POS 2.54MM
Contact Length - Mating: 0.250" (6.35mm)
Row Spacing - Mating: 0.100" (2.54mm)
Insulation Material: Liquid Crystal Polymer (LCP)
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.350" (8.89mm)
Contact Shape: Square
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Natural
Contact Material: Phosphor Bronze
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Operating Temperature: -55°C ~ 125°C
Style: Board to Cable/Wire
Number of Rows: 2
Number of Positions: 26
Mounting Type: Surface Mount
Current Rating (Amps): 3.4A per Contact
Connector Type: Header
Features: Keying Slot
Packaging: Tube
Produkt ist nicht verfügbar
Mindestbestellmenge: 14 Stücke
Im Einkaufswagen
Stück im Wert von UAH



