ICA-320-SGG Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
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Technische Details ICA-320-SGG Samtec Inc.
Description: CONN IC DIP SOCKET 20POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote ICA-320-SGG
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
|
ICA-320-SGG | Samtec |
IC & Component Sockets |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| ICA-320-SGG |
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Hersteller: Samtec
IC & Component Sockets
IC & Component Sockets
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


