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Technische Details ICA-320-SGT Samtec
Description: CONN IC DIP SOCKET 20POS GOLD, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper.
Weitere Produktangebote ICA-320-SGT nach Preis ab 7.62 EUR bis 9.06 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICA-320-SGT | Samtec Inc. |
 Description: CONN IC DIP SOCKET 20POS GOLDContact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
auf Bestellung 64 Stücke: Lieferzeit 10-14 Tag (e) |
|
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| ICA-320-SGT | SAMTEL |
09+ |
auf Bestellung 5 Stücke: Lieferzeit 21-28 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| ICA-320-SGT |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: CONN IC DIP SOCKET 20POS GOLD
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
auf Bestellung 64 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.06 EUR |
| 10+ | 8.23 EUR |
| 25+ | 7.8 EUR |
| 50+ | 7.62 EUR |
| ICA-320-SGT |
|
Hersteller: SAMTEL
09+
09+
auf Bestellung 5 Stücke:
Lieferzeit 21-28 Tag (e)