| Anzahl | Preis |
|---|---|
| 1+ | 6.92 EUR |
| 28+ | 6.25 EUR |
| 56+ | 5.81 EUR |
| 112+ | 5.72 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ICA-632-SST Samtec
Description: CONN IC DIP SOCKET 32POS GOLD, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube.
Weitere Produktangebote ICA-632-SST nach Preis ab 6.37 EUR bis 9.54 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ICA-632-SST | Samtec Inc. |
 Description: CONN IC DIP SOCKET 32POS GOLDContact Material - Post: Brass Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
auf Bestellung 527 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICA-632-SST |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC DIP SOCKET 32POS GOLD
Contact Material - Post: Brass
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
auf Bestellung 527 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 9.54 EUR |
| 10+ | 8.63 EUR |
| 25+ | 8.16 EUR |
| 50+ | 7.96 EUR |
| 100+ | 7.56 EUR |
| 250+ | 6.76 EUR |
| 500+ | 6.37 EUR |