ICF-316-T-O-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
| Anzahl | Privatkunde |
|---|---|
| 700+ | 2.93 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Mindestmenge:
700 Stücke
Produktrezensionen
Produktbewertung abgeben
Technische Details ICF-316-T-O-TR Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote ICF-316-T-O-TR nach Preis ab 2.78 EUR bis 6.83 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICF-316-T-O-TR | Samtec |
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket |
auf Bestellung 810 Stücke: Lieferzeit 10-14 Tag (e) |
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ICF-316-T-O-TR | Samtec Inc. |
Description: CONN IC DIP SOCKET 16POS TIN Features: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICF-316-T-O-TR |
|
Hersteller: Samtec
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket
auf Bestellung 810 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.61 EUR |
| 50+ | 3.77 EUR |
| 100+ | 3.2 EUR |
| 700+ | 2.84 EUR |
| 1400+ | 2.78 EUR |
| ICF-316-T-O-TR |
|
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.83 EUR |
| 10+ | 5.2 EUR |
| 25+ | 4.68 EUR |
| 50+ | 4.33 EUR |
| 100+ | 4.01 EUR |
| 250+ | 3.64 EUR |