ICF-316-T-O-TR Samtec Inc.
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN
Contact Material - Post: Beryllium Copper
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Liquid Crystal Polymer (LCP)
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Tape & Reel (TR)
| Anzahl | Preis |
|---|---|
| 700+ | 2.46 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details ICF-316-T-O-TR Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN, Contact Material - Post: Beryllium Copper, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Liquid Crystal Polymer (LCP), Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Tape & Reel (TR).
Weitere Produktangebote ICF-316-T-O-TR nach Preis ab 2.34 EUR bis 5.74 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ICF-316-T-O-TR | Samtec |
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket |
auf Bestellung 810 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||
|
|
ICF-316-T-O-TR | Samtec Inc. |
Description: CONN IC DIP SOCKET 16POS TINFeatures: Open Frame Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
auf Bestellung 990 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICF-316-T-O-TR |
![]() |
Hersteller: Samtec
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket
IC & Component Sockets .100 Surface Mount Screw Machine DIP Socket
auf Bestellung 810 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 1+ | 3.87 EUR |
| 50+ | 3.17 EUR |
| 100+ | 2.69 EUR |
| 700+ | 2.39 EUR |
| 1400+ | 2.34 EUR |
| ICF-316-T-O-TR |
![]() |
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Description: CONN IC DIP SOCKET 16POS TIN
Features: Open Frame
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
auf Bestellung 990 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis |
|---|---|
| 4+ | 5.74 EUR |
| 10+ | 4.37 EUR |
| 25+ | 3.93 EUR |
| 50+ | 3.64 EUR |
| 100+ | 3.37 EUR |
| 250+ | 3.06 EUR |

