ICF-628-T-O-TR Samtec Inc.
Hersteller: Samtec Inc.Description: CONN IC DIP SOCKET 28POS TIN
Features: Open Frame
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Liquid Crystal Polymer (LCP)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 250 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 250+ | 5.59 EUR |
Produktrezensionen
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Technische Details ICF-628-T-O-TR Samtec Inc.
Description: CONN IC DIP SOCKET 28POS TIN, Features: Open Frame, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Liquid Crystal Polymer (LCP), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICF-628-T-O-TR nach Preis ab 4.29 EUR bis 7.99 EUR
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ICF-628-T-O-TR | Hersteller : Samtec Inc. |
Description: CONN IC DIP SOCKET 28POS TIN Packaging: Cut Tape (CT) Features: Open Frame Mounting Type: Surface Mount Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Liquid Crystal Polymer (LCP) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 255 Stücke: Lieferzeit 10-14 Tag (e) |
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Produkt ist nicht verfügbar |