ICM-314-1-GT-HT Adam Tech
| Anzahl | Privatkunde |
|---|---|
| 3+ | 1.33 EUR |
| 10+ | 1.13 EUR |
| 25+ | 0.99 EUR |
| 100+ | 0.96 EUR |
| 250+ | 0.86 EUR |
| 1000+ | 0.82 EUR |
| 3000+ | 0.75 EUR |
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Technische Details ICM-314-1-GT-HT Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 14P, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 14 (2 x 7), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICM-314-1-GT-HT nach Preis ab 1.24 EUR bis 1.84 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
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ICM-314-1-GT-HT | Adam Tech |
 Description: MACHINE PIN SOCKET, IC, DIP, 14PFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 324 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICM-314-1-GT-HT |
|
Hersteller: Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 14P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: MACHINE PIN SOCKET, IC, DIP, 14P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 324 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.84 EUR |
| 14+ | 1.56 EUR |
| 33+ | 1.43 EUR |
| 66+ | 1.37 EUR |
| 132+ | 1.3 EUR |
| 264+ | 1.24 EUR |