ICM-628-1-GT-HT Adam Tech
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.24 EUR |
| 17+ | 1.82 EUR |
| 51+ | 1.77 EUR |
| 102+ | 1.7 EUR |
| 255+ | 1.55 EUR |
| 510+ | 1.33 EUR |
| 1003+ | 1.2 EUR |
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Technische Details ICM-628-1-GT-HT Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 28P, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -40°C ~ 105°C, Number of Positions or Pins (Grid): 28 (2 x 14), Termination: Solder, Housing Material: Polyphenylene Sulfide (PPS), Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper, Part Status: Active.
Weitere Produktangebote ICM-628-1-GT-HT nach Preis ab 1.65 EUR bis 2.7 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
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ICM-628-1-GT-HT | Adam Tech |
 Description: MACHINE PIN SOCKET, IC, DIP, 28PFeatures: Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -40°C ~ 105°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper Part Status: Active |
auf Bestellung 1758 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICM-628-1-GT-HT |
|
Hersteller: Adam Tech
Description: MACHINE PIN SOCKET, IC, DIP, 28P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
Description: MACHINE PIN SOCKET, IC, DIP, 28P
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -40°C ~ 105°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Beryllium Copper
Part Status: Active
auf Bestellung 1758 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.7 EUR |
| 17+ | 2.2 EUR |
| 34+ | 2.09 EUR |
| 51+ | 2.03 EUR |
| 102+ | 1.94 EUR |
| 255+ | 1.82 EUR |
| 510+ | 1.74 EUR |
| 1003+ | 1.65 EUR |