ICO-320-SGT Samtec
| Anzahl | Privatkunde |
|---|---|
| 1+ | 10.03 EUR |
| 10+ | 9.65 EUR |
| 110+ | 8.04 EUR |
| 506+ | 6.81 EUR |
| 1012+ | 5.81 EUR |
| 2508+ | 5.34 EUR |
| 5016+ | 5.24 EUR |
Produktrezensionen
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Technische Details ICO-320-SGT Samtec
Description: CONN IC DIP SOCKET 20POS GOLD, Termination: Solder, Number of Positions or Pins (Grid): 20 (2 x 10), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyester, Glass Filled.
Weitere Produktangebote ICO-320-SGT nach Preis ab 7.33 EUR bis 10.78 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ICO-320-SGT | Samtec Inc. |
Description: CONN IC DIP SOCKET 20POS GOLD Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polyester, Glass Filled |
auf Bestellung 532 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICO-320-SGT |
Hersteller: Samtec Inc.
Description: CONN IC DIP SOCKET 20POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
Description: CONN IC DIP SOCKET 20POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polyester, Glass Filled
auf Bestellung 532 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.78 EUR |
| 10+ | 9.79 EUR |
| 25+ | 9.28 EUR |
| 50+ | 9.07 EUR |
| 100+ | 8.63 EUR |
| 250+ | 7.56 EUR |
| 500+ | 7.33 EUR |