ICS-306-T Adam Tech

Description: IC SOCKET, DIP, 6P 2.54MM PITCH
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 5790 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
100+ | 0.18 EUR |
122+ | 0.14 EUR |
142+ | 0.12 EUR |
320+ | 0.11 EUR |
1040+ | 0.10 EUR |
2560+ | 0.10 EUR |
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Technische Details ICS-306-T Adam Tech
Description: IC SOCKET, DIP, 6P 2.54MM PITCH, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 6 (2 x 3), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote ICS-306-T
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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ICS-306-T | Hersteller : Adam Technologies |
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