ICS-308-T Adam Tech

Description: IC SOCKET, DIP, 8P 2.54MM PITCH
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Material - Mating: Phosphor Bronze
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Phosphor Bronze
Part Status: Active
auf Bestellung 7210 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
91+ | 0.19 EUR |
117+ | 0.15 EUR |
125+ | 0.14 EUR |
132+ | 0.13 EUR |
300+ | 0.12 EUR |
540+ | 0.11 EUR |
2520+ | 0.10 EUR |
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Technische Details ICS-308-T Adam Tech
Description: IC SOCKET, DIP, 8P 2.54MM PITCH, Features: Open Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 8 (2 x 4), Termination: Solder, Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Phosphor Bronze, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Phosphor Bronze, Part Status: Active.
Weitere Produktangebote ICS-308-T
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
ICS-308-T | Hersteller : Adam Technologies |
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