Technische Details ICS-632-T Adam Technologies
Description: IC SOCKET, DIP, 32P 2.54MM PITCH, Packaging: Tube, Contact Material - Post: Phosphor Bronze, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Phosphor Bronze, Contact Finish - Mating: Tin, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polybutylene Terephthalate (PBT), Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 32 (2 x 16), Operating Temperature: -55°C ~ 105°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Open Frame.
Weitere Produktangebote ICS-632-T nach Preis ab 0.36 EUR bis 2.59 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
ICS-632-T | Adam Tech |
 IC & Component Sockets 32P / .600" |
auf Bestellung 1181 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
 |
ICS-632-T | Adam Tech |
Description: IC SOCKET, DIP, 32P 2.54MM PITCH Packaging: Tube Contact Material - Post: Phosphor Bronze Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Phosphor Bronze Contact Finish - Mating: Tin Pitch - Mating: 0.100" (2.54mm) Housing Material: Polybutylene Terephthalate (PBT), Glass Filled Termination: Solder Number of Positions or Pins (Grid): 32 (2 x 16) Operating Temperature: -55°C ~ 105°C Type: DIP, 0.6" (15.24mm) Row Spacing Mounting Type: Through Hole Features: Open Frame |
auf Bestellung 2372 Stücke: Lieferzeit 10-14 Tag (e) |
|
| ICS-632-T |
|
Hersteller: Adam Tech
IC & Component Sockets 32P / .600"
IC & Component Sockets 32P / .600"
auf Bestellung 1181 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 0.58 EUR |
| 10+ | 0.46 EUR |
| 30+ | 0.43 EUR |
| 60+ | 0.4 EUR |
| 105+ | 0.38 EUR |
| 255+ | 0.36 EUR |
| ICS-632-T |
|
Hersteller: Adam Tech
Description: IC SOCKET, DIP, 32P 2.54MM PITCH
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Description: IC SOCKET, DIP, 32P 2.54MM PITCH
Packaging: Tube
Contact Material - Post: Phosphor Bronze
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Phosphor Bronze
Contact Finish - Mating: Tin
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 32 (2 x 16)
Operating Temperature: -55°C ~ 105°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
auf Bestellung 2372 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.59 EUR |
| 15+ | 2.14 EUR |
| 30+ | 2.05 EUR |
| 60+ | 1.95 EUR |
| 105+ | 1.87 EUR |
| 255+ | 1.76 EUR |
| 510+ | 1.68 EUR |
| 1005+ | 1.59 EUR |