INMP405ACEZ-R0 InvenSense
Hersteller: InvenSense
Omnidirectional Microphone with Bottom Port and Analog Output INMP405
Anzahl je Verpackung: 10000 Stücke
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Technische Details INMP405ACEZ-R0 InvenSense
Description: MIC MEMS ANALOG OMNI -38DB, Frequency Range: 200 Hz ~ 15 kHz, Voltage Range: 1.5 V ~ 3.3 V, Current - Supply: 250 µA, Impedance: 200 Ohms, Part Status: Obsolete, Height (Max): 0.039" (0.98mm), Port Location: Bottom, Direction: Omnidirectional, Termination: Solder Pads, S/N Ratio: 62dB, Type: MEMS (Silicon), Shape: Rectangular, Sensitivity: -38dB ±3dB @ 94dB SPL, Size / Dimension: 0.132" L x 0.098" W (3.35mm x 2.50mm), Output Type: Analog, Packaging: Cut Tape (CT).
Weitere Produktangebote INMP405ACEZ-R0
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INMP405ACEZ-R0 | TDK InvenSense |
Description: MIC MEMS ANALOG OMNI -38DBFrequency Range: 200 Hz ~ 15 kHz Voltage Range: 1.5 V ~ 3.3 V Current - Supply: 250 µA Impedance: 200 Ohms Part Status: Obsolete Height (Max): 0.039" (0.98mm) Port Location: Bottom Direction: Omnidirectional Termination: Solder Pads S/N Ratio: 62dB Type: MEMS (Silicon) Shape: Rectangular Sensitivity: -38dB ±3dB @ 94dB SPL Size / Dimension: 0.132" L x 0.098" W (3.35mm x 2.50mm) Output Type: Analog Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| INMP405ACEZ-R0 |
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Hersteller: TDK InvenSense
Description: MIC MEMS ANALOG OMNI -38DB
Frequency Range: 200 Hz ~ 15 kHz
Voltage Range: 1.5 V ~ 3.3 V
Current - Supply: 250 µA
Impedance: 200 Ohms
Part Status: Obsolete
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Direction: Omnidirectional
Termination: Solder Pads
S/N Ratio: 62dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -38dB ±3dB @ 94dB SPL
Size / Dimension: 0.132" L x 0.098" W (3.35mm x 2.50mm)
Output Type: Analog
Packaging: Cut Tape (CT)
Description: MIC MEMS ANALOG OMNI -38DB
Frequency Range: 200 Hz ~ 15 kHz
Voltage Range: 1.5 V ~ 3.3 V
Current - Supply: 250 µA
Impedance: 200 Ohms
Part Status: Obsolete
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Direction: Omnidirectional
Termination: Solder Pads
S/N Ratio: 62dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -38dB ±3dB @ 94dB SPL
Size / Dimension: 0.132" L x 0.098" W (3.35mm x 2.50mm)
Output Type: Analog
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
