IPC-TEST-FLUX-1-DRY Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: SOLDERABILITY TESTING FLUX #1 FO
Packaging: Bulk
Type: Flux - No Clean, Liquid
Form: Bottle, 1 oz (28.35g)
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
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Technische Details IPC-TEST-FLUX-1-DRY Chip Quik Inc.
Description: SOLDERABILITY TESTING FLUX #1 FO, Packaging: Bulk, Type: Flux - No Clean, Liquid, Form: Bottle, 1 oz (28.35g), Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C), Shelf Life Start: Date of Manufacture, Shelf Life: 24 Months.
Weitere Produktangebote IPC-TEST-FLUX-1-DRY
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
|---|---|---|---|---|---|
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IPC-TEST-FLUX-1-DRY | Chip Quik |
Solder Solderability Testing Flux #1 for Tin/Lead Solder IPC J-STD-002, Dry Powder - Makes 19ml with 15ml of IPA (IPA not included) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| IPC-TEST-FLUX-1-DRY |
|
Hersteller: Chip Quik
Solder Solderability Testing Flux #1 for Tin/Lead Solder IPC J-STD-002, Dry Powder - Makes 19ml with 15ml of IPA (IPA not included)
Solder Solderability Testing Flux #1 for Tin/Lead Solder IPC J-STD-002, Dry Powder - Makes 19ml with 15ml of IPA (IPA not included)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH