Technische Details IPC0014-S Chip Quik
Description: STENCIL 4X4MM .5MM, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: QFN/LFCSP, Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm), Number of Positions: 24.
Weitere Produktangebote IPC0014-S nach Preis ab 20.8 EUR bis 20.8 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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IPC0014-S | Chip Quik Inc. |
 Description: STENCIL 4X4MM .5MMPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 24 |
auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0014-S |
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Hersteller: Chip Quik Inc.
Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
Description: STENCIL 4X4MM .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 24
auf Bestellung 21 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 20.8 EUR |