IPC0017-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm)
Number of Positions: 28
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Technische Details IPC0017-S Chip Quik Inc.
Description: QFN-28 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: QFN/LFCSP, Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.122" L x 0.122" W (3.10mm x 3.10mm), Number of Positions: 28.
Weitere Produktangebote IPC0017-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0017-S | Hersteller : Chip Quik | Sockets & Adapters QFN-28 Stainless Steel Stencil |
Produkt ist nicht verfügbar |