IPC0047 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERSOIC-36/PSOP-36/HSOP-36
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Description: POWERSOIC-36/PSOP-36/HSOP-36
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details IPC0047 Chip Quik Inc.
Description: POWERSOIC-36/PSOP-36/HSOP-36, Packaging: Bulk, Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm), Material: FR4 Epoxy Glass, Number of Positions: 36, Pitch: 0.026" (0.65mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, PSOP, HSOP.
Weitere Produktangebote IPC0047
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0047 | Hersteller : Chip Quik | Sockets & Adapters PowerSOIC-36 to DIP- 40 SMT Adapter |
Produkt ist nicht verfügbar |