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Technische Details IPC0049 Chip Quik
Description: POWERSOIC-20/PSOP-20/HSOP-20, Packaging: Bulk, Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm), Material: FR4 Epoxy Glass, Number of Positions: 20, Pitch: 0.050" (1.27mm), Board Thickness: 0.062" (1.57mm) 1/16", Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, PSOP, HSOP, Part Status: Active.
Weitere Produktangebote IPC0049 nach Preis ab 14.49 EUR bis 14.49 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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IPC0049 | Chip Quik Inc. |
 Description: POWERSOIC-20/PSOP-20/HSOP-20Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Part Status: Active |
auf Bestellung 9 Stücke: Lieferzeit 10-14 Tag (e) |
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| IPC0049 |
|
Hersteller: Chip Quik Inc.
Description: POWERSOIC-20/PSOP-20/HSOP-20
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
Description: POWERSOIC-20/PSOP-20/HSOP-20
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 14.49 EUR |