IPC0050-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE
Number of Positions: 10
Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm)
Type: PowerSOIC
Pitch: 0.050" (1.27mm)
Material: Stainless Steel
Packaging: Bulk
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Technische Details IPC0050-S Chip Quik Inc.
Description: POWERSOIC-10/PSOP-10/HSOP-10 STE, Number of Positions: 10, Thermal Center Pad: 0.413" L x 0.291" W (10.50mm x 7.40mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.370" L x 0.295" W (9.40mm x 7.50mm), Type: PowerSOIC, Pitch: 0.050" (1.27mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote IPC0050-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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IPC0050-S | Hersteller : Chip Quik |
Sockets & Adapters PowerSOIC-10 Steel Stencil |
Produkt ist nicht verfügbar |