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Technische Details IPC0051-S Chip Quik
Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI, Number of Positions: 8, Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm), Part Status: Active, Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm), Type: PowerSOIC, Pitch: 0.050" (1.27mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote IPC0051-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
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IPC0051-S | Hersteller : Chip Quik Inc. |
 Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCINumber of Positions: 8 Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm) Part Status: Active Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Type: PowerSOIC Pitch: 0.050" (1.27mm) Material: Stainless Steel Packaging: Bulk |
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