IPC0059-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Number of Positions: 8
Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Type: DFN
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
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Technische Details IPC0059-S Chip Quik Inc.
Description: DFN-8 STENCIL, Number of Positions: 8, Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm), Type: DFN, Pitch: 0.020" (0.50mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote IPC0059-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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IPC0059-S | Hersteller : Chip Quik |
Sockets & Adapters DFN-8 Stainless Steel Stencil |
Produkt ist nicht verfügbar |