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Technische Details IPC0063-S Chip Quik
Description: DFN-8 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.026" (0.65mm), Type: DFN, Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm), Number of Positions: 8.
Weitere Produktangebote IPC0063-S
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde |
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IPC0063-S | Chip Quik Inc. |
Description: DFN-8 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm) Number of Positions: 8 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| IPC0063-S |
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Hersteller: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH


