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Technische Details IPC0079-S Chip Quik
Description: MSOP-16 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: MSOP, Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm), Number of Positions: 16.
Weitere Produktangebote IPC0079-S nach Preis ab 22.41 EUR bis 22.41 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
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IPC0079-S | Chip Quik Inc. |
 Description: MSOP-16 STENCILPackaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm) Number of Positions: 16 |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
|
| IPC0079-S |
|
Hersteller: Chip Quik Inc.
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
Description: MSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.063" W (3.00mm x 1.60mm)
Number of Positions: 16
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.41 EUR |