IPC0101-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm)
Number of Positions: 56
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Technische Details IPC0101-S Chip Quik Inc.
Description: QFN-56 STENCIL, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.016" (0.40mm), Type: QFN/LFCSP, Inner Dimension: 0.354" L x 0.197" W (9.00mm x 5.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.281" L x 0.136" W (7.13mm x 3.45mm), Number of Positions: 56.
Weitere Produktangebote IPC0101-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0101-S | Hersteller : Chip Quik | Sockets & Adapters QFN-56 Stainless Steel Stencil |
Produkt ist nicht verfügbar |