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Technische Details IPC0144-S Chip Quik
Description: QFN-56 STENCIL, Number of Positions: 56, Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm), Part Status: Active, Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm), Type: QFN/LFCSP, Pitch: 0.016" (0.40mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote IPC0144-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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IPC0144-S | Hersteller : Chip Quik Inc. |
 Description: QFN-56 STENCILNumber of Positions: 56 Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm) Part Status: Active Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Type: QFN/LFCSP Pitch: 0.016" (0.40mm) Material: Stainless Steel Packaging: Bulk |
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