
IPC0156-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
Produkt ist nicht verfügbar
Produktrezensionen
Produktbewertung abgeben
Technische Details IPC0156-S Chip Quik Inc.
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM, Packaging: Bulk, Material: Stainless Steel, Pitch: 0.025" (0.64mm), Type: TSSOP, Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Part Status: Active, Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm), Number of Positions: 44.
Weitere Produktangebote IPC0156-S
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
---|---|---|---|---|---|
![]() |
IPC0156-S | Hersteller : Chip Quik |
![]() |
Produkt ist nicht verfügbar |