
IPC0159-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: DFN-22 (0.5MM PITCH, 6X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.236" L x 0.118" W (6.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.211" L x 0.065" W (5.35mm x 1.65mm)
Number of Positions: 22
Description: DFN-22 (0.5MM PITCH, 6X3MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.236" L x 0.118" W (6.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.211" L x 0.065" W (5.35mm x 1.65mm)
Number of Positions: 22
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Technische Details IPC0159-S Chip Quik Inc.
Description: DFN-22 (0.5MM PITCH, 6X3MM BODY), Packaging: Bulk, Material: Stainless Steel, Pitch: 0.020" (0.50mm), Type: DFN, Inner Dimension: 0.236" L x 0.118" W (6.00mm x 3.00mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Thermal Center Pad: 0.211" L x 0.065" W (5.35mm x 1.65mm), Number of Positions: 22.
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IPC0159-S | Hersteller : Chip Quik |
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