IPC0168 Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
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Technische Details IPC0168 Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 TO DIP-, Packaging: Bulk, Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm), Material: FR4 Epoxy Glass, Number of Positions: 16, Pitch: 0.050" (1.27mm), Board Thickness: 0.063" (1.60mm), Proto Board Type: SMD to DIP, Package Accepted: PowerSOIC, Part Status: Active.
Weitere Produktangebote IPC0168
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
IPC0168 | Hersteller : Chip Quik | Sockets & Adapters PowerPAD-16/Power SOIC-16 to DIP-20 |
Produkt ist nicht verfügbar |