IPC0175-S Chip Quik Inc.
Hersteller: Chip Quik Inc.
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X
Number of Positions: 20
Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm)
Type: QFN/LFCSP
Pitch: 0.020" (0.50mm)
Material: Stainless Steel
Packaging: Bulk
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Technische Details IPC0175-S Chip Quik Inc.
Description: QFN-20/LFCSP-20 (0.5MM PITCH, 4X, Number of Positions: 20, Thermal Center Pad: 0.100" L x 0.081" W (2.55mm x 2.05mm), Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm), Inner Dimension: 0.157" L x 0.138" W (4.00mm x 3.50mm), Type: QFN/LFCSP, Pitch: 0.020" (0.50mm), Material: Stainless Steel, Packaging: Bulk.
Weitere Produktangebote IPC0175-S
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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IPC0175-S | Hersteller : Chip Quik |
 Sockets & Adapters QFN-20 Stainless Steel Stencil |
Produkt ist nicht verfügbar |